Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: QCCN
External dimensions/packaging: QCCN
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube, Rail
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
5962-9220303M2A
|
Integrated Device Technology | 功能相似 | LCC |
Buffer/Line Driver 8CH Non-Inverting 3-ST CMOS 20Pin CLLCC
|
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