Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-16
External dimensions/packaging: SOIC-16
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PI3B3257WEX
|
Diodes | 功能相似 | SOP |
2:1 3.3 V 5 Ohm 表面贴装 多路复用器 / 多路解复用器 - SOIC-16W
|
||
PI3B3257WEX
|
Pericom Semiconductor | 功能相似 | SOIC-16 |
2:1 3.3 V 5 Ohm 表面贴装 多路复用器 / 多路解复用器 - SOIC-16W
|
||
QS3VH257S1G
|
Integrated Device Technology | 功能相似 | SOIC-16 |
Multiplexer/Demultiplexer Bus Switch 1Element 8IN 16Pin SOIC N
|
||
|
|
Renesas Electronics | 功能相似 | SOIC-16 |
总线开关, 4 放大器, 总线开关, 9 ohm, SOIC, 16 引脚
|
||
QS3VH257S1G8
|
Integrated Device Technology | 功能相似 | SOIC-16 |
总线开关, 4 放大器, 总线开关, 9 ohm, SOIC, 16 引脚
|
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