Technical parameters/testing frequency: 100 MHz
Encapsulation parameters/Encapsulation: 0805
External dimensions/packaging: 0805
Other/Protection Style: Molded
Other/Lead Finish: Silver/Palladium/Platinum
Other/Test Frequency: 100 MHz
Other/Core Materials: Ceramic
Other/Max Processing Temps: 260
Other/Package/Case: 0805
Other/Tolerance: 5 %
Other/Type: Chip
Other/Product Length: 2.3 mm
Compliant with standards/RoHS standards: RoHS Compliant
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