Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SSOP
External dimensions/packaging: SSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LTC1708EG-PG#PBF
|
Linear Technology | 功能相似 | SSOP-36 |
DC-DC电源芯片 LTC1708EG-PG#PBF SSOP-36-5.6mm
|
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