Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: DFN
External dimensions/packaging: DFN
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LTC2861CDE#TRPBF
|
Linear Technology | 功能相似 | DFN-12 |
IC TXRX RS485 20Mbps 12-DFN
|
||
|
|
ADI | 功能相似 | DFN |
IC TXRX RS485 20Mbps 12-DFN
|
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