Technical parameters/Contact electroplating: Tin
Technical parameters/halogen-free state: Low Halogen
Encapsulation parameters/installation method: Surface Mount
Physical parameters/contact material: Copper
Physical parameters/insulation material: Non-Insulated
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/ELV standards: Compliant
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC000756
|
Multicomp | 功能相似 |
MULTICOMP MC000756 接线端子, 压片式, 7.94MM, 压接
|
|||
PV8-38R-QY
|
Panduit | 类似代替 |
端子, 环形舌片, 3/8英寸, 8AWG, 红色
|
|||
RD8-38
|
Thomas & Betts | 类似代替 |
THOMAS & BETTS RD8-38 接线端子, 环形, 3/8英寸, 压接, 红色
|
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