Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SOMC1605191AGEA
|
Vishay Semiconductor | 功能相似 |
Res Thick Film NET 330Ω/470Ω 2% 1.2W ±100ppm/℃ TERM Molded 16Pin DIP Gull Wing SMD T/R
|
|||
SOMC1605191AGEA
|
Vishay Dale | 功能相似 | SOIC-16 |
Res Thick Film NET 330Ω/470Ω 2% 1.2W ±100ppm/℃ TERM Molded 16Pin DIP Gull Wing SMD T/R
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review