Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74FCT162245ATPAG
|
Integrated Device Technology | 功能相似 | TSSOP-48 |
收发器, 双向, -40至85度 C
|
||
IDT74FCT162245ATPAG
|
Integrated Device Technology | 功能相似 | TSSOP-48 |
IC BI-DIR TRANSCVR 16Bit 48TSSOP
|
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