Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: CDIP
External dimensions/packaging: CDIP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AM27C256-255DC
|
Cypress Semiconductor | 功能相似 |
EPROM UV 256Kbit 32K x 8 250ns 28Pin CDIP
|
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