Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Rochester | 功能相似 | TSSOP |
AND Gate 4Element 2IN CMOS 14Pin SOIC
|
||
74HC08D
|
Philips | 功能相似 | SOP |
AND Gate 4Element 2IN CMOS 14Pin SOIC
|
||
74HC08D
|
Toshiba | 功能相似 | SOIC-14 |
AND Gate 4Element 2IN CMOS 14Pin SOIC
|
||
74HC08D
|
Nexperia | 功能相似 | SOIC-14 |
AND Gate 4Element 2IN CMOS 14Pin SOIC
|
||
|
|
NXP | 功能相似 | SO-14 |
AND Gate 4Element 2IN CMOS Automotive 14Pin SO
|
||
|
|
Rochester | 功能相似 |
AND Gate 4Element 2IN CMOS Automotive 14Pin SO
|
|||
MM74HC08M
|
TI | 功能相似 | SOP |
AND Gate 4Element 2IN CMOS 14Pin SOIC
|
||
MM74HC08M
|
ON Semiconductor | 功能相似 | SOIC-14 |
AND Gate 4Element 2IN CMOS 14Pin SOIC
|
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