Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7204L15J
|
Integrated Device Technology | 功能相似 | PLCC-32 |
FIFO Mem Async Dual Depth/Width Uni-Dir 4K x 9 32Pin PLCC
|
||
7204L15TP
|
Integrated Device Technology | 功能相似 | PDIP-28 |
FIFO Mem Async Dual Depth/Width Uni-Dir 4K x 9 28Pin PDIP
|
||
|
|
Renesas Electronics | 功能相似 | DIP-28 |
先进先出 4K X 9 ASYNC 先进先出
|
||
7204L15TPI
|
Integrated Device Technology | 功能相似 | DIP-28 |
先进先出 4K X 9 ASYNC 先进先出
|
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