Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: TSSOP-48
External dimensions/packaging: TSSOP-48
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
9DB803DGLFT
|
Integrated Device Technology | 功能相似 | TSSOP-48 |
时钟缓冲器 8 OUTPUT PCIE GEN2 BUFFER
|
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