Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7202LA15PDGI
|
Integrated Device Technology | 功能相似 | DIP-28 |
FIFO Mem Async Dual Depth/Width Uni-Dir 1K x 9 28Pin PDIP Tube/Tray
|
||
7202LA15SOGI
|
Integrated Device Technology | 功能相似 | SOIC-28 |
FIFO, 1KX9, 15ns, Asynchronous, CMOS, PDSO28, GREEN, SOIC-28
|
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