Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOT-363
External dimensions/packaging: SOT-363
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
UMN11NTN
|
ROHM Semiconductor | 功能相似 | TSSOP-6 |
开关二极管,ROHM ### 二极管和整流器,ROHM Semiconductor
|
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