Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-16
External dimensions/packaging: TSSOP-16
Other/Product Lifecycle: Supply in progress
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DAC8554
|
TI | 功能相似 | TSSOP-16 |
16 位、四通道、超低短时脉冲波形干扰、电压输出数模转换器
|
||
DAC8554
|
Burr Brown | 功能相似 |
16 位、四通道、超低短时脉冲波形干扰、电压输出数模转换器
|
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