Encapsulation parameters/installation method: Screw
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: 2-9D1B
External dimensions/packaging: 2-9D1B
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TIM1414-4LA
|
Toshiba | 类似代替 | 2-9D1B |
Trans FET 15V 5.2A GaAs 3Pin 2-9D1B
|
||
TIM1414-7
|
Toshiba | 类似代替 | 2-9D1B |
MICROWAVE POWER GaAs FET 15V 5.7A 3Pin 2-9D1B
|
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