Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP-16
External dimensions/packaging: TSSOP-16
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74HC153PW,118
|
NXP | 功能相似 | TSSOP-16 |
多路复用器, HC系列, 2路, 4:1, 2 V至6 V, TSSOP-16
|
||
74HC153PW,118
|
Nexperia | 功能相似 | TSSOP-16 |
多路复用器, HC系列, 2路, 4:1, 2 V至6 V, TSSOP-16
|
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