Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: VSON
External dimensions/packaging: VSON
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Maxim Integrated | 功能相似 | VSON |
Hot Swap Controller 1CH 72V 6Pin TDFN EP
|
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MAX5903NNETT+T
|
Maxim Integrated | 功能相似 | WDFN-6 |
Power Supply Support Circuit, Fixed, 1Channel, BICMOS, PDSO6, 3 X 3MM, 0.8MM HEIGHT, LEAD FREE, MO-229WEEA, TDFN- 6
|
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