Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Customs information/ECCN code: 3A001
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
5962-8552508XA
|
Pyramid | 功能相似 | DIP |
Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, CERDIP-28
|
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