Technical parameters/forward current (Max): 100 mA
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: SOT-323-3-1
External dimensions/packaging: SOT-323-3-1
Other/Product Lifecycle: Active
Other/Manufacturing Applications: Wireless Communications, High Speed Data Networks
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: Contains SVHC
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BAP64-06,215
|
NXP | 类似代替 | SOT-23-3 |
BAP64 系列 200 V 175 mA 硅 PIN 二极管 封装 TO-236AB
|
||
BAP64-06,215
|
Philips | 类似代替 | TO-236 |
BAP64 系列 200 V 175 mA 硅 PIN 二极管 封装 TO-236AB
|
||
BAP64-06W,115
|
NXP | 功能相似 | SOT-323-3 |
NXP BAP64-06W,115 PIN 二极管, Ifor=100mA, Vrev=100V, SHF, 3引脚 UMT封装, 使用于衰减器、开关
|
||
BAR64-06W
|
Infineon | 功能相似 | SOT-323-3-1 |
硅PIN二极管 Silicon PIN Diode
|
||
BAR64-06W
|
Siemens Semiconductor | 功能相似 | SOT-323 |
硅PIN二极管 Silicon PIN Diode
|
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