Encapsulation parameters/installation method: Through Hole
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Box (TB)
Other/Manufacturing Applications: General
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S681K29Y5PN63J5R
|
VISHAY | 完全替代 |
Cap Ceramic 680pF 1000V Y5P 10% (7.5 X 4mm) Radial 5mm 85℃ Bulk
|
|||
S681K29Y5PN63J5R
|
Vishay Semiconductor | 完全替代 |
Cap Ceramic 680pF 1000V Y5P 10% (7.5 X 4mm) Radial 5mm 85℃ Bulk
|
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