Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: TSSOP-24
External dimensions/length: 7.8 mm
External dimensions/width: 4.4 mm
External dimensions/packaging: TSSOP-24
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ICS8536AG-01LF
|
Integrated Device Technology | 功能相似 | TSSOP-24 |
IC CLK BUFFER 3:6 700MHz 24TSSOP
|
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