Technical parameters/Contact electroplating: Gold
Technical parameters/insulation resistance: 10.0 GΩ
Technical parameters/Contact resistance: 2.50 mΩ
Technical parameters/number of plug and unplug cycles: 500
Technical parameters/operating temperature (Max): 155 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Solder
External dimensions/height: 9 mm
Physical parameters/contact material: Beryllium Copper
Physical parameters/materials: Brass
Physical parameters/medium materials: Teflon
Physical parameters/insulation material: Teflon
Compliant with standards/RoHS standards:
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
11 MMCX-50-1-1/111OE
|
Suhner | 完全替代 |
HUBER & SUHNER 11 MMCX-50-1-1/111OE 射频/同轴连接器, MMCX同轴, 直型插头, 压接, 50 ohm, RG178B/U, RG196A/U, RG196A/U, 铍铜
|
|||
37-02M-5-TGG
|
Multicomp | 类似代替 |
MULTICOMP 37-02M-5-TGG 射频/同轴连接器, MMCX同轴, 直角插头, 压接, 50 ohm, RG178, 铍铜
|
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