Encapsulation parameters/Encapsulation: LBGA
External dimensions/packaging: LBGA
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
UPD44325092BF5-E40-FQ1-A
|
Renesas Electronics | 功能相似 | BGA |
SRAM Chip Sync Dual 1.8V 36M-Bit 4M x 9Bit 0.45ns 165Pin BGA
|
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