Technical parameters/Contact electroplating: Nickel
Encapsulation parameters/installation method: Through Hole
Physical parameters/materials: Plastic
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Power Management, power management
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BH4AAAW
|
Memory Protection Devices | 类似代替 | Chassis |
HOLDER BATT 4-AAA CELLS WIRE LDS
|
||
BH4AAAW
|
Hammond Manufacturing | 类似代替 |
HOLDER BATT 4-AAA CELLS WIRE LDS
|
|||
HH-3631
|
BUD | 功能相似 |
BUD INDUSTRIES HH-3631 电池座
|
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