Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PI3B3244LE
|
Pericom Semiconductor | 功能相似 | TSSOP-20 |
Bus Switch 2Element CMOS 8IN 20Pin TSSOP Tube
|
||
QS3VH244PAG8
|
Integrated Device Technology | 功能相似 | TSSOP-20 |
Bus Switch 2Element 8IN 20Pin TSSOP T/R
|
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