Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS90LV017ATMX/NOPB
|
National Semiconductor | 功能相似 | SOIC |
LVDS Driver 0.45V 8Pin SOIC N T/R
|
||
FIN1017M
|
ON Semiconductor | 功能相似 | SOP |
LVDS Driver 600Mbps 0.45V 8Pin SOIC N
|
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