Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-56
External dimensions/packaging: TSSOP-56
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Renesas Electronics | 功能相似 | TFSOP-56 |
IC REGISTERD TRCVR 18Bit 56TSSOP Last Buy Day:2016/1/22
|
||
IDT74FCT16501CTPAG8
|
Integrated Device Technology | 功能相似 | TSSOP |
IC TXRX 18Bit REGISTERED 56TSSOP
|
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