Technical parameters/power supply voltage: 1.8 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 456
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XCV300E-6FG456C
|
Xilinx | 功能相似 | BBGA-456 |
逻辑门 XCV300E-6FG456C BGA-256
|
||
XCV300E-7FG456C
|
Xilinx | 功能相似 | BBGA-456 |
FPGA Virtex-E Family 82.944K Gates 6912 Cells 400MHz 0.18um Technology 1.8V 456Pin FBGA
|
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