Package parameters/number of pins: 80
Encapsulation parameters/Encapsulation: LBGA
External dimensions/packaging: LBGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Cut Tape (CT)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M58BW16FB4ZA3F
|
Micron | 功能相似 | BGA |
NOR Flash Parallel 3.3V 16Mbit 512K x 32Bit 45ns 80Pin LBGA T/R
|
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