Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: LBGA-256
External dimensions/packaging: LBGA-256
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Xilinx | 类似代替 | LBGA-256 |
XCR3512XL 10FT256I 磨码
|
||
XCR3512XL-10FTG256I
|
Xilinx | 类似代替 | LBGA-256 |
XCR3512XL 10FTG256I 磨码
|
||
XCR3512XL-12FTG256I
|
Xilinx | 类似代替 | LBGA-256 |
XCR3512XL 12FTG256I 磨码
|
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