Technical parameters/line gauge: 2.00 AWG
Technical parameters/Contact electroplating: Tin
Encapsulation parameters/installation method: Lug
Physical parameters/contact material: Copper
Physical parameters/materials: Copper
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/REACH SVHC standards: No SVHC
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC000756
|
Multicomp | 功能相似 |
MULTICOMP MC000756 接线端子, 压片式, 7.94MM, 压接
|
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