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Model 10-5L
Description Soder-Wick® The desoldering and desoldering are encapsulated in an electrostatic dissipation reel. Greatly reduces rework/repair time and minimizes the risk of damage to the board. The patented non corrosive, halide free, wash free organic flux BGA desoldering design is used to remove solder from BGA pads and chips with a spool length of 1.5 or 3m. Note that Series 50 and Series 82 include rosin and rosin SD desoldering cores and tapes
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Packaging method
Standard packaging quantity 1
25.71  yuan 25.71yuan
5+:
$ 30.0819
50+:
$ 28.7963
200+:
$ 28.0764
500+:
$ 27.8964
1000+:
$ 27.7165
2500+:
$ 27.5108
5000+:
$ 27.3822
7500+:
$ 27.2537
Quantity
5+
50+
200+
500+
1000+
Price
$30.0819
$28.7963
$28.0764
$27.8964
$27.7165
Price $ 30.0819 $ 28.7963 $ 28.0764 $ 27.8964 $ 27.7165
Start batch production 5+ 50+ 200+ 500+ 1000+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(7784) Minimum order quantity(5)
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External dimensions/length: 1.5 m

External dimensions/width: 2.5 mm

Compliant with standards/RoHS standards: RoHS Compliant

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Model Brand Similarity Encapsulation Introduction Data manual

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