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Model 60-2-5
Description Soder-Wick® The desoldering and desoldering are encapsulated in an electrostatic dissipation reel. Greatly reduces rework/repair time and minimizes the risk of damage to the board. The patented non corrosive, halide free, wash free organic flux BGA desoldering design is used to remove solder from BGA pads and chips with a spool length of 1.5 or 3m. Note that Series 50 and Series 82 include rosin and rosin SD desoldering cores and tapes
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Brand: Illinois Tool Works
Packaging
Delivery time
Packaging method
Standard packaging quantity 1
29.8  yuan 29.8yuan
5+:
$ 34.8683
50+:
$ 33.3782
200+:
$ 32.5438
500+:
$ 32.3352
1000+:
$ 32.1266
2500+:
$ 31.8881
5000+:
$ 31.7391
7500+:
$ 31.5901
Quantity
5+
50+
200+
500+
1000+
Price
$34.8683
$33.3782
$32.5438
$32.3352
$32.1266
Price $ 34.8683 $ 33.3782 $ 32.5438 $ 32.3352 $ 32.1266
Start batch production 5+ 50+ 200+ 500+ 1000+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(3586) Minimum order quantity(5)
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External dimensions/length: 1.5 m

External dimensions/width: 1.5 mm

Physical parameters/color: Yellow

Physical parameters/materials: Brass

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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Model Brand Similarity Encapsulation Introduction Data manual

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  • ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
  • Address: Room 611, Block A, Aerospace Building, No. 4019, Shennan Avenue, Futian District, Shenzhen, Guangdong Province, China
  • Tel: +86-0755-82866643

CONTACT INFORMATION

  • WhatsApp：+8615820418003
  • Facebook Messenger：Emily He
  • WeChat：15820418003
  • Telegram：+8613641420552
  • Microsoft Teams：newkasion1
  • E-mail：sales@icgoodfind.com
  • Technical Cooperation：Ericguo@icgoodfind.com
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