Technical parameters/RAM size: 16K x 8
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 40 ℃
Technical parameters/power supply voltage (Max): 1.95 V
Technical parameters/power supply voltage (Min): 1.65 V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TFBGA-144
External dimensions/length: 12 mm
External dimensions/width: 12 mm
External dimensions/height: 0.8 mm
External dimensions/packaging: TFBGA-144
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LPC2292FET144/01
|
NXP | 功能相似 | TFBGA |
NXP LPC2292FET144/01 微控制器, 32位, ARM7TDMI, 60 MHz, 256 KB, 16 KB, 144 引脚, TFBGA
|
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