Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM4860M
|
TI | 功能相似 | SOIC-16 |
TEXAS INSTRUMENTS LM4860M 音频功率放大器, 1通道, 1 W, 2.7V 至 5.5V, SOIC, 16 引脚
|
||
TPA4861DR
|
TI | 功能相似 | SOIC-8 |
TEXAS INSTRUMENTS TPA4861DR 芯片, 音频功率放大器
|
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