Technical parameters/Static current: 139 µA
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 4
Encapsulation parameters/Encapsulation: VFBGA
External dimensions/packaging: VFBGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
TI | 功能相似 | VFBGA |
Audio Amp Microphone 1CH Mono Class-AB 4Pin uSMD T/R
|
||
|
|
TI | 功能相似 | VFBGA |
前置放大IC的高增益2线麦克风 Pre-Amplified IC’s for High Gain 2-Wire Microphones
|
||
LMV1012UP-15
|
National Semiconductor | 功能相似 | VFBGA |
前置放大IC的高增益2线麦克风 Pre-Amplified IC’s for High Gain 2-Wire Microphones
|
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