Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: VFBGA
External dimensions/packaging: VFBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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|
TI | 功能相似 | VFBGA |
前置放大IC的高增益2线麦克风 Pre-Amplified IC’s for High Gain 2-Wire Microphones
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