Encapsulation parameters/installation method: Through Hole
Physical parameters/operating temperature: -55℃ ~ 105℃
Other/Body Orientation: Right Angle
Other/Counting: Through Hole
Other/Lead Finish: Tin
Other/Determination Methods: Solder
Other/Bitch: 2.77 mm
Other/Operating Temperature: -55 to 105 °C
Other/Max Processing Temps: 260
Other/Genter: M/F
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review