Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 484
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: 3A001.a.2.c
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AX1000-2FGG484
|
SOC | 类似代替 | BGA-484 |
Field Programmable Gate Array, 12096 CLBs, 1000000Gates, 870MHz, 18144-Cell, CMOS, PBGA484, 1MM PITCH, ROHS COMPLIANT, FBGA-484
|
||
AX1000-2FGG484I
|
Microsemi | 类似代替 | BGA-484 |
Field Programmable Gate Array, 12096 CLBs, 1000000Gates, 870MHz, 18144-Cell, CMOS, PBGA484, 1MM PITCH, ROHS COMPLIANT, FBGA-484
|
||
AX1000-2FGG484I
|
SOC | 类似代替 | BGA-484 |
Field Programmable Gate Array, 12096 CLBs, 1000000Gates, 870MHz, 18144-Cell, CMOS, PBGA484, 1MM PITCH, ROHS COMPLIANT, FBGA-484
|
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