182198-1 In Stock|PDF|Datasheet|Price|Agent[182198-1 Alternative|Silk Screen|Technology|Solution Development]-ICGOODFIND

Warm reminder: The pictures are for reference only. The actual product may vary

Model 182198-1

Description TE Connectivity AMPMODU Mod I TE Connectivity AMPMODU Mod I socket crimping contact series. For crimping tools, please refer to inventory number 509-2010. **Contact details * *: 509-1988 22-18 AWG (0.3-0.9 mm), SCP, gold-plated, loose 509-1994 22-18 AWG (0.3-0.9 mm), SCP, tin plated, loose 509-2004 22-18 AWG (0.3-0.9 mm), HCP, tin plated, loose 718-9747 2-18 AWG (0.3-0.9 mm), HCP, gold-plated, strip 668-9381 2-18 AWG (0.3-0.9 mm), HCP, tin plated, strip 668-9384 2-18 AWG (0.3-0.9 mm), SCP, tin plated, strip 668-9387 22-18 AWG (0.3-0.9 mm), SCP, Gold Plated, Strip 668-9390 20-17 AWG (0.5-1.0 mm), HCP, Tin Plated, Strip 745-5845 22-18 AWG (0.3-0.9 mm), HCP, Gold Plated, Loose 745-5097 2-18 AWG (0.3-0.9 mm), HCP, Gold Plated, Strip # # 3.96mm TE Connectivity AMPMODU ™ – Mod I is a robust large-scale connector system used to connect wires to circuit boards in application environments such as power supply, industrial control, and switchgear.

Brand: TE Connectivity

Packaging -

Delivery time

Packaging method Bulk

Standard packaging quantity 1

5+:

$ 2.2140

25+:

$ 2.0500

50+:

$ 1.9352

100+:

$ 1.8860

500+:

$ 1.8532

2500+:

$ 1.8122

5000+:

$ 1.7958

10000+:

$ 1.7712

Price	$ 2.2140	$ 2.0500	$ 1.9352	$ 1.8860	$ 1.8532
Start batch production	5+	25+	50+	100+	500+

Freight charges： In stock Freight rate：$13.00

Quantity：

Inventory(3948) Minimum order quantity(5)

Add to Cart Buy now

Welcome to use ICGOODFIND AI Assistant

Chip AI consultant

Download related files

PDF

Specification parameters
PDF
Silk screen printing
Review and share the purchase （0 ）
Product inquiry (0)
Selection Manual
Adapter model (0)

Technical parameters/polarity: Female

Technical parameters/line gauge: 18AWG ~ 22AWG

Technical parameters/Contact electroplating: Tin

Technical parameters/rated current: 5 A

Technical parameters/direction: Vertical

Technical parameters/Contact resistance: 12 mΩ

Technical parameters/rated current (Max): 5 A

Technical parameters/operating temperature (Max): 60 ℃

Technical parameters/operating temperature (Min): -65 ℃

Encapsulation parameters/Encapsulation: -

External dimensions/packaging: -

Physical parameters/contact material: Phosphor Bronze

Other/Product Lifecycle: Active

Other/Packaging Methods: Bulk

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Compliant with standards/ELV standards: Compliant

Compliant with standards/REACH SVHC standards: No SVHC

Compliant with standard/REACH SVHC version: 2014/06/16

Customs information/ECCN code: EAR99

Customs information/HTS code: 8538908040

Alternative material

Model	Brand	Similarity	Encapsulation	Introduction	Data manual
02-06-5130	Molex	功能相似		MOLEX 02-06-5130 触芯, 1855系列, 母, 压接, 24 AWG, 镀金触芯, Standard .062" Series Connectors	PDF
280702-1	TE Connectivity	功能相似	-	TE Connectivity AMPMODU Mod I 插座压接触点 TE Connectivity AMPMODU Mod I 插座压接触点系列。有关压接工具，请参见库存号 509-2010。触点详情： 509-1988 22-18 awg (0.3-0.9 mm)，SCP，镀金，松散 509-1994 22-18 awg (0.3-0.9 mm)，SCP，镀锡，松散 509-2004 22-18 awg (0.3-0.9 mm)，HCP，镀锡，松散 718-9747 2-18 awg (0.3-0.9 mm)，HCP，镀金，条带 668-9381 2-18 awg (0.3-0.9 mm)，HCP，镀锡，条带 668-9384 2-18 awg (0.3-0.9 mm)，SCP，镀锡，条带 668-9387 22-18 awg (0.3-0.9 mm)，SCP，镀金，条带 668-9390 20-17 awg (0.5-1.0 mm)，HCP，镀锡，条带 745-5845 22-18 awg (0.3-0.9 mm)，HCP，镀金，松散 745-5097 2-18 awg (0.3-0.9 mm)，HCP，镀金，条带 ### 3.96mm TE Connectivity AMPMODU™ – Mod I 坚固的大规模连接器系统，用于在供电、工业控制和开关设备等应用环境中实现电线至电路板连接。	PDF
280702-1	Tyco Electronics	功能相似		TE Connectivity AMPMODU Mod I 插座压接触点 TE Connectivity AMPMODU Mod I 插座压接触点系列。有关压接工具，请参见库存号 509-2010。触点详情： 509-1988 22-18 awg (0.3-0.9 mm)，SCP，镀金，松散 509-1994 22-18 awg (0.3-0.9 mm)，SCP，镀锡，松散 509-2004 22-18 awg (0.3-0.9 mm)，HCP，镀锡，松散 718-9747 2-18 awg (0.3-0.9 mm)，HCP，镀金，条带 668-9381 2-18 awg (0.3-0.9 mm)，HCP，镀锡，条带 668-9384 2-18 awg (0.3-0.9 mm)，SCP，镀锡，条带 668-9387 22-18 awg (0.3-0.9 mm)，SCP，镀金，条带 668-9390 20-17 awg (0.5-1.0 mm)，HCP，镀锡，条带 745-5845 22-18 awg (0.3-0.9 mm)，HCP，镀金，松散 745-5097 2-18 awg (0.3-0.9 mm)，HCP，镀金，条带 ### 3.96mm TE Connectivity AMPMODU™ – Mod I 坚固的大规模连接器系统，用于在供电、工业控制和开关设备等应用环境中实现电线至电路板连接。	PDF