Technical parameters/number of logic gates: 32800
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: FPBGA-672
External dimensions/length: 27 mm
External dimensions/width: 27 mm
External dimensions/height: 1.65 mm
External dimensions/packaging: FPBGA-672
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray, Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LFEC33E-3FN672I
|
Lattice Semiconductor | 类似代替 | FPBGA-672 |
FPGA - 现场可编程门阵列 32.8K LUTs 1.2V -3 Spd I
|
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