Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 32
Encapsulation parameters/Encapsulation: VQFN-32
External dimensions/packaging: VQFN-32
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Legerity | 功能相似 | Surface Mount |
SLIC 1CH 63dB 120mA 5V 44Pin TQFP Tray
|
||
|
|
Microchip | 功能相似 | QFP-44 |
SLIC 1CH 63dB 120mA 5V 44Pin TQFP Tray
|
||
LE79555-2BVC
|
Microsemi | 功能相似 | TQFP-44 |
SLIC 1CH 63dB 120mA 5V 44Pin TQFP Tray
|
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