Technical parameters/number of circuits: 1
Technical parameters/power supply voltage: 1.7V ~ 2.7V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: TSSOP-28
External dimensions/length: 9.70 mm
External dimensions/width: 4.40 mm
External dimensions/packaging: TSSOP-28
External dimensions/thickness: 1.00 mm
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
9P936AGLF
|
Integrated Device Technology | 完全替代 | TSSOP-28 |
低偏移的双组DDR I / II扇出缓冲器 Low Skew Dual Bank DDR I/II Fan-out Buffer
|
||
9P936AGLFT
|
Integrated Device Technology | 完全替代 | TSSOP-28 |
低偏移的双组DDR I / II扇出缓冲器 Low Skew Dual Bank DDR I/II Fan-out Buffer
|
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