Technical parameters/tolerances: ±5 %
Technical parameters/forward voltage: 1.4V @1A
Technical parameters/dissipated power: 500 mW
Technical parameters/test current: 20 mA
Technical parameters/voltage regulation value: 3.3 V
Technical parameters/rated power (Max): 500 mW
Technical parameters/operating temperature (Max): 175 ℃
Technical parameters/operating temperature (Min): -65 ℃
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: B-MELF
External dimensions/packaging: B-MELF
Physical parameters/operating temperature: -65℃ ~ 175℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Bag
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
1N6312US
|
Microsemi | 完全替代 | B-MELF |
无空隙,密封的表面贴装500 mW的玻璃齐纳二极管 VOIDLESS-HERMETICALLY-SEALED Surface Mount 500 mW Glass Zener Diodes
|
||
|
|
Microsemi | 完全替代 | B-MELF |
B-MELF 3.3V 0.5W(1/2W)
|
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