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Model 2-1571552-6
Description TE Connectivity Printed Circuit Board DIP Socket - Economy 800 Series Economy 800 Series Printed Circuit Board DIP Socket features an open trapezoidal frame style and a 2.54mm centerline. These printed circuit board DIP IC sockets can be installed vertically and embossed with four finger paired gold-plated contacts. Precision four finger internal contacts provide concentric funnel-shaped entry ports for flat and circular leads to be inserted into X and Y stackable open ladders for easy cooling, cleaning, and inspection. Thin design allows for rectangular or circular IC leads without capillary action. The bottom enclosed sleeve provides 100% anti flux and solder contamination protection and has been certified by Underwriters Laboratories component program (file number E111362). Beryllium copper internal contacts achieve the highest mechanical and electrical performance. # # # IC socket - DIL molded pins
Product QR code
Brand: TE Connectivity
Packaging -
Delivery time
Packaging method Tube
Standard packaging quantity 1
10.8  yuan 10.8yuan
5+:
$ 12.6337
50+:
$ 12.0938
200+:
$ 11.7914
500+:
$ 11.7158
1000+:
$ 11.6402
2500+:
$ 11.5539
5000+:
$ 11.4999
7500+:
$ 11.4459
Quantity
5+
50+
200+
500+
1000+
Price
$12.6337
$12.0938
$11.7914
$11.7158
$11.6402
Price $ 12.6337 $ 12.0938 $ 11.7914 $ 11.7158 $ 11.6402
Start batch production 5+ 50+ 200+ 500+ 1000+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(8124) Minimum order quantity(5)
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Technical parameters/number of contacts: 20

Technical parameters/polarity: Female

Technical parameters/Contact electroplating: Gold

Technical parameters/rated current: 3 A

Technical parameters/insulation resistance: 5000 MΩ

Technical parameters/number of rows: 2

Technical parameters/number of pins: 20

Technical parameters/rated current (Max): 3A/contact

Technical parameters/operating temperature (Max): 125 ℃

Technical parameters/operating temperature (Min): -55 ℃

Technical parameters/Contact resistance (Max): 10 mΩ

Encapsulation parameters/installation method: Through Hole

Package parameters/number of pins: 20

Encapsulation parameters/Encapsulation: -

External dimensions/length: 25.4 mm

External dimensions/width: 4.57 mm

External dimensions/height: 4.57 mm

External dimensions/packaging: -

Physical parameters/contact material: Beryllium Copper

Physical parameters/operating temperature: -55℃ ~ 105℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Tube

Other/Manufacturing Applications: Signal

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Customs information/ECCN code: EAR99

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
694-43-320-00-670000 694-43-320-00-670000 Mill-Max 功能相似
Conn DIP Socket SKT 20POS 2.54mm Solder ST Thru-Hole Tube
694-43-320-00-671000 694-43-320-00-671000 Mill-Max 功能相似
Conn DIP Socket SKT 20POS 2.54mm Solder ST Thru-Hole Tube

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