Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC
External dimensions/length: 9.90 mm
External dimensions/width: 3.90 mm
External dimensions/packaging: SOIC
External dimensions/thickness: 1.50 mm
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube, Rail
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY2308SXC-2
|
Cypress Semiconductor | 功能相似 | SOIC-16 |
CY2308 系列 单 PLL 3.3 V 133 MHz 零延时时钟缓冲器 表面贴装 - SOIC-16
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review