Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 0.87V ~ 0.93V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 780
Encapsulation parameters/Encapsulation: FBGA-780
External dimensions/packaging: FBGA-780
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 完全替代 | BGA |
FPGA Stratix® IV GX Family 175750 Cells 40nm Technology 0.9V 780Pin FC-FBGA
|
||
EP4SGX180DF29C4N
|
Intel | 完全替代 | BGA |
FPGA Stratix IV GX Family 175750 Cells 40nm Technology 0.9V 780Pin FC-FBGA
|
||
|
|
Intel | 类似代替 | BGA |
FPGA Stratix® IV GX Family 175750 Cells 40nm Technology 0.9V 780Pin FC-FBGA
|
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