Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: PB free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS2762BE+
|
Dallas Semiconductor | 功能相似 | TSSOP |
MAXIM INTEGRATED PRODUCTS DS2762BE+. 芯片, 电池监视/保护器
|
||
DS2762BE+T&R
|
Maxim Integrated | 功能相似 | TSSOP-16 |
电池管理 High-Prec Li+ Bat Monitor w/Alerts
|
||
|
|
Dallas Semiconductor | 功能相似 |
电池管理 High-Prec Li+ Bat Monitor w/Alerts
|
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