Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Dallas Semiconductor | 功能相似 | DIP |
Y2K-Compliant, Nonvolatile Timekeeping RAMs
|
||
DS1746-70
|
Maxim Integrated | 功能相似 | DIP-32 |
Y2K-Compliant, Nonvolatile Timekeeping RAMs
|
||
DS1746-70+
|
Dallas Semiconductor | 完全替代 | EDIP-32 |
MAXIM INTEGRATED PRODUCTS DS1746-70+ 芯片, 实时时钟
|
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